Large image sensors depend on the wafer’s size. Even with just one image sensor per wafer, the optically active area was not sufficient for our customer's intended application. In close cooperation with this customer, we ensured that all necessary connections to the peripherals could be placed on the short sensor side.
Using a special mechanical design technology, we created the basic requirements for implementing the optical connections of the cascadable sensor with nearly no image loss.
There were no existing standards for the processing of sensors of such dimensions. The processes had to be specifically developed for this application.