BEYOND THE LIMITS OF
OPTICS AND ELECTRONICS

Large image sensors depend on the wafer’s size. Even with just one image sensor per wafer, the optically active area was not sufficient for our customer's intended application. In close cooperation with this customer, we ensured that all necessary connections to the peripherals could be placed on the short sensor side.

Using a special mechanical design technology, we created the basic requirements for implementing the optical connections of the cascadable sensor with nearly no image loss.

There were no existing standards for the processing of sensors of such dimensions. The processes had to be specifically developed for this application.

HEALTH CARE & LIFE SCIENCESENSORS
• TECHNOLOGY SHARE
• PROJECT DURATION IN MONTHS
  36
  36
• FIRST PATTERN IN DAYS
  365
  365
• DEGREE OF INNOVATION
  10
  10

Image sensors with extended sensitivity in the near UV range are not standard solutions. A very efficient method to achieve this property is local thinning. Walls of just 3μm thickness between the pixels are preserved. The processing of such image sensors is critical. The cleanliness requirements for the processing are extremely high, since particles in the cavities that formed above the pixels can no longer be removed non-destructively. The handling of the sensors in the chip-on-board process is also critical, as the filigree walls between pixels can be quickly destroyed, thus resulting in a failure.
With our clean rooms the best conditions were given to position the sensor exactly with a self-developed special tool.
Our clean rooms provided best conditions to position the sensor accurately using a self-developed tool.

HEALTH CARE & LIFE SCIENCESENSORS
• TECHNOLOGY SHARE
• Project duration in months
  36
  36
• FIRST PATTERN IN DAYS
  365
  365
• Degree of innovation
  10
  10